Metallic/Non-metallic Materials | Electronic Component |
PCB/PCBA |
Purposes:
Observation samples internal structure and defect analysis, electroplating technology analysis and slice analysis of the sample can be used to observe morphology and composition verify samples suspected abnormal crack and hollow etc.
Applications:
Ceramics, plastics, electroplating products, composite materials, welding, metal / non-metal products, auto parts and accessories etc
Test flow:
Take samples→Cleaning→Vacuum mosaic→Grinding→Polishing→Micro etching (if necessary)→Metallographic microscope / scanning electron microscope observation / composition analysis.
Reference standard:
IPC-TM 650 2.1.1 etc.
Typical test images:
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Corrosion depth | |
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Foreign material | Crack depth |
Shenzhen Meixin Testing Technology Co., Ltd.