Cross Section of Printed Circuit Board/Assembly Board

Purposes:

Cross section can make quality judgment and preliminary analysis on the cause of the poor as well as test multi-property of printed board, such as resin contamination, coating cracks, the stratification of hole wall, solder coating, the thickness of the layers, the thickness of the coating, plating thickness, hole lateral erosion, the inner ring width, coincidence degree between the layers, the coating quality, the hole wall roughness, etc. Through the printed circuit board micro cutting technology obtained micro-section can be used to check the PCB internal wire thickness, layer number, hole aperture size, hole quality observation, PCBA solder inner cavity, interface combination status, wetting quality evaluation etc.

Applications:

PCB/PCBA, integrated circuits, etc

Test flow：

Take samples→Cleaning→Vacuum mosaic→Grinding→Polishing→Observe

Reference standard:

IPC-TM 650 2.1.1 , IPC-TM 650-2.2.5, IPC A 600, IPC A 610 etc.

Typical test images:

BGA solder ball empty solder
CPU solder ball empty solder	PTH internal void
PCB copper layer thickness	PCB inner structure cracking